FC-BGA Report June 2006

English 320'000 JPY, approximately 2900 USD - A4 - 170 pages

Outline of the Report

― Analysis of Market trend of FC-BGA and the Substrate by IC and layer-count of Build-up substrate
― Technical trend of FC-BGA substrate
― Supply Chain of FC-BGA by IC (used for PC, video game, etc)
― Trends in Markets for Major Applications of FC-BGA

Table of the content

Market Report for Flexible Printed Circuits (FPC) 2005

English 300'000 JPY, approximately 2750 USD

The Inception of the Adhesiveless FCCL Industry in Korea - June 16th 2005
3-layer FCCL, which has an epoxy adhesive layer (or an acrylic adhesive layer) between the copper and the polyimide, had been necessary for the manufacture of FPC and flexible substrates. Around 1999, 2-layer FCCL, which has neither epoxy nor acrylic between the copper and the polyimide, began to be used. The production value of 2-layer FCCL exceeded that of 3-layer FCCL in Japan in 2004. Outside Japan, 2-Layer FCCL is getting popular, too.

Among all the regional markets for 2-Layer FCCL, the Korean market seems to be the most promising. During the period between the second half of 2004 and the first half of 2005, Korean FCCL manufacturers has been gradually moving from the development/small production stage to the volume production stage.

Hanwha, Doosan, SD Flex, and LG Chemical are producing a small quantity of the cast-type FCCL. LG Cable, Hyun Sung St, and Atec Engineering are almost ready for volume production of the sputtering-type FCCL. Sang-A Flontec is producing a large quantity of the lamination-type FCCL. Hanwha and Doosan are also planning to participate in the lamination-type market. Supported by Japanese corporations, LG Cable's new lines will begin mass production in April 2005. DuPont and Cheil Industries, a Samsung company, have established a joint venture company named SD Flex, and SD Flex's lines will begin production in the third quarter of 2005.

Besides the Korean corporations, Taiwanese corporations such as Crest Technology, DuPont Wirex, Taiflex, ThinfFex are new participants in the 2-layer FCCL industry in Asia. Thus the competition among the Asian FCCL manufacturers must become keen in the near future.

Due to the growing demand for COF and multi-layer FPC used in cellular phones, the 2-layer FCCL market is expected to keep expanding. It is certain that, in the world, the production value of 2-layer FCCL will exceed that of 3-layer FCCL in the near future. Because of the structural change in the FCCL industry, the line-up of the industry leaders has changed. In the past, manufacturers of 3-layer FCCL such as DuPont, Arisawa, Nikkan were the leaders in the industry.

Nowadays, Nippon Steel Chemical, a manufacturer of 2-layer FCCL, is the leader in the industry.

Japan Marketing Survey Co., Ltd. has published a research report on the world FCCL industry by closely examining technological and marketing aspects of the industry.

English - 320'000 JPY, approximately 2900 USD (Express shipping included) - A4 - 193 pages