SURVEYS II   -   Japan Marketing Survey

is represented by PCBspecialist (same price)
Direct Imaging (DI) Technology for next generation PWB (Printed Wiring Board) and FPD (Flat Panel Display) manufacturing

The latest Market Trend for Direct Imaging (DI) Technology for next Generation of PCBs (Printed Circuit Boards) and FDP (Flat Panel Display) manufacturing
Published on July 20th, 2005 by Japan Marketing Survey, 190 pages, English, 500'000 JPY, approximately 4'500 USD

  • Outline
    • Market size of DI systems & Photo Resist 2002-2009.
    • Future Market analysis & associated Materials for PCB
    • Analysis for Deployment of DI Technology on FPD
    • Demand Analysis for DI Photoresist by wave length, application and form (Liquid/Film)
    • Status of major system Manufacturers, Photo Resist Manufacturers & DI Users

Table of content

  • Section 1, Market analysis
  •       Executive summary......................................................................................................................................................2
    1. Specification of various DI systems.......................................................................................................................4
    2. Status of major manufacturer of systems………………………………………………………........……….……..5
    3. Installation status of DI system in PCB industry (Estimated by JMS, incl on order)
      • 3.1 Japan…………………………………………………………………………………………………..…...6
      • 3.2 Europe……………………………………………………………………………………...……................7
      • 3.3 USA........................................................................................................................................................9
      • 3.4 Asia Pacifie excluding Japan............................................................................................................. 10
    4. DI manufacturers' share for 2004 (Calendar year)
      • 4.1 Over market (Total for FPD, PCB and other applications)………………………………………........11
      • 4.2 For PCB application..........................................................................................................................12
    5. DI systems market size actual and fore cast
      • 5.1 Total market (FPD, PCB and others)………………………………………………………………….…13
      • 5.2 For PCB application by Type(Rigid, FPC)
        1. Unit base.........................................................................................................................................16
        2. Amount base..................................................................................................................................17
    6. Comparison with 405mm laser type, 405nm lamp type, 355nm laser type…………………………...................18
    7. DI systems market forecast for FPD Application (For color filter, For PDP and others) 2002-2004…….................20
    8. Japanese CAM market for 2003...........................................................................................................................21
    9. Summary of user trend
      • 9.1 Major products, Status of DI system introduction, resist used, expose system, size of work……….....22
      • 9.2 Plan for DI, No of system, expectations for DI, target products and others……………………..........24
      • 9.3 Required throughput, expose accuracy, L/S, price of the system and expose energy………….....…25
      • 9.4 Satisfaction with the DI system, Needs for improvement, Questions, Opinion and comments…......26
      • 9.5 Trend of solder mask specification (Accuracy, resolution, thickness, L/S)……......…………………....27
  • Section 2, Resist market analysis for DI
  1. DI resist manufacturers
  2. For PCB patterning…………………………………………………………………………………………....……...29
  3. Solder mask supplier by Wavelength for PCB ……………………...…………………….....................................30
  4. Resist supplier for FPO ……………………….………………...………...…………………….................................30
  5. Alliances in the industry
    1. Case Eternal and Nichigo-Morton.............................................................................................................31
    2. Case TOK...................................................................................................................................................32
  • 2.       Comparison of resist materials for DI
  • 2.1.             Patterning resist
  • 2.1.1.       For 365nm wavelength……….…………………………………………………………………………...…33
  • 2.1.2.        For 405nm wavelength………………………………………………………………………...….......…….35
  • 2.1.3.       For visible light............................................................................................................................……......36
  • 2.2.    Solder mask…………………………………………………………………………………………………………..37
  • 3.       Price trend of resist
  • 3.1.    Patterning resist.................................................................................................................................................38
  • 3.2.    Solder mask………………………………………………...…………………………………………………..……38
  • 4.      Technical trends
  • 4.1.    Wavelength of (laser) light source and photosensitive materials…………………………………..……………39
  • 4.2.    Resist manufacturer and system manufacturer by wavelength (PCB and FPD)…………………..…....………40
  • 5.   DI resist users by suppliers (status in Japan).................................................................................................................41
  • 6.   Sales status and market share of DI resist -2004­
  • 6.1.             Patterning resist for PCB (Sales volume, share)…………………………..…………………………………….42
  • 6.2.             Solder mask.................................................................................................................................................. 42
  • 7.   Market size forecast for DI resist -2002-2009­
  • 7.1.             Overall market size (amount)……………………………………………………………………………...……43
  • 7.2.             Patterning resist (amount) -2002-2009-………………….…………………………………………………....…44
  • 7.3.             Resist market forecast for PCB -2002-2009­
  • 7.3.1.        Patterning DFR………………………………………………………………………………….……...…….45
  • 7.3.2.        Solder mask market forecast for PWB-2002-2009-………………………………………………….…...….47
  • 7.3.3.        Back grounds for the market activity…………………………………………………………………...….49
  • Section 3, Trend of Flat Danel Display and DI technology deployment
  • 1.       Trend of FPD
  • 1.1.             Overview of various FPD -LCD, PDP, OEL, Others………………………….………….....................................51
  • 1.2.            Trend of the FPD industry................................................................................................................................52
  • 1.3.             Overall FPD market -2003-2009-………………………………….……………………………………...……….53
  • 1.4.            The trends of LCD market
  • 1.4.1.        Participants in LCD panel
  • 1)      Japan…………………………………………………………………..………………………..……………55
  • 2)      Korea…………………………………………………………………………………………….……………56
  • 3)      Taiwan………………………………………………………………………………………………..……….57
  • 1.4.2.        Market size for LCD panel, actual and forecast by region and application (2003-2007)
  • 1)      By region (Amount, production base)………………………………………………………………….…..58
  • 2)      By application (in Volume, Production base)…………………………………………………………..….59
  • 1.4.3.        LCD manufacturers' share (2004)…………………….…………………………………………………..…60
  • 1.5.             The trends of PDP market
  • 1.5.1.       Participants (by size)................................................................................................................................61
  • 1.5.2.        PDP market size, actual and forecast (2003-2007)…………………………………………………….......62
  • 1.5.3.        PDP manufacturers' share (2004, production base)…………………………………………………...…. 63
  • 1.6.            The trends of Color filter (CF) market
  • 1.6.1.      Manufacturers (External sales)……………………………………………………………………………….64
  • 1.6.2.       Market size of color filter, Actual and forecast (External sales, amount base)…………………........… 65
  • 1.6.3.       Color filter manufacturers' share (2004, External sales, Amount base)…………………………….....…..66
  • 2.       Status of DI system in FPD industry and its future potential by applications (LCD, PDP, Color filter)
  • 2.1.             Status of patterning systems various types in FPD industry…………………………………………………… 67
  • 2.2.           Patterning process and DI technology users………………………………………………………………..…..68
  • 2.3.             PDP manufacturing process..............................................................................................................………69
  • 2.4.             Typical manufacturing process of color filter (pigment disperse) (w/Column spacer)……………….....….70
  • 2.5.             Size of master glass and status of equipment introduction as of the end of 2004...................................... 72
  • 2.6.             Comparison of performance of existing exposure system and DI system for various processes
    • and possibility of use of DI system on those processes……………………….................................... 73
  • 2.7.             Possible substituting from Exposure to 01 system on FPD related area........................................................ 74
  • 2.8.             Potential market size as DI system (market of proximity exposure system for FPD)……...……………....…..75
  • 2.9.             Market size and forecasting for 01 system in FPD industry (2002-2009)…………………………………..……76
  • <Reference> Specification of patterning system for FPD......................................................................................... 77
  • Section 4, Case study for System Manufacturers

Orbotech……………………………………………………………………………………………………………...…....….…..80

Hitachi Via Mechanics………………………………………………………………………………………………..…....……. 85

Nano System Solutions………………………………………………………………………………………………......………. 88

Pentax Industrial Instruments………………………………………………………………………………………....……...….. 89

Fuji Photo Film……………………………………………………………………………………………………...….…………. 96

Dainippon Screen Mfg………………………………………………………………………………………………….....……. 100

Section 5, Case study for Resist Manufacturers

    List of Major Manufacturers

    List of manufacturers for Patterning Photo Resist for PCB.......................................................................104

    List of manufacturers of Photo Solder Mask Resist for PCB......................................................................106

    List of manufacturers of Resist for Flat Panels..........................................................................................109

     

List of manufacturer of Resist for Flat Panels

    Asahi Kasei Electronics.......................................................................................................................................... 110

    Kolon..................................................................................................................................................................... 115

    Taiyo Ink Mfg.......................................................................................................................................................... 118

    Tamura Kaken........................................................................................................................................................ 126

    Eternal.................................................................................................................................................................... 132

    DuPont MRC DryFilm............................................................................................................................................... 137

    Nichigo-Morton....................................................................................................................................................... 146

    Hitachi Chemical.................................................................................................................................................... 153

    Mitsubishi Chemical................................................................................................................................................ 160

     

Section 6, Case study for DI users

    Company A (Japanese PCB manufacturer)..............................................................................,,,,,,,,,,,...................... 165

    Company B (Japanese PCB manufacturer)............................................................................,,,,,,,,,,,,........................ 169

    Company C (Korean PCB manufacturer)............................................................................,,,,,,,,,,,,........................... 173

    Company D (Korean FPC manufacturer)....................................................................................................................177

    Company E (Korean FPC manufacturer).................................................................................................................... 178

    Company F (Japanese FPC manufacturer) …………………………………………………………………….…..…....179

    Company G (Japanese PCB manufacturer)................................................................................................................180

    Company H (Korean PCB manufacturer)....................................................................................................................183

    Company I (Japanese PCB manufacturer)………………………………………………………………….….………...185

    Company J (Japanese lead frame manufacturer)..................................................................................................... 187

    Company K (Japanese FPC manufacturer) ………………………………………………………………………...…....189
     





 


 





 
 





 

 

 

The Inception of the Adhesiveless FCCL Industry in Korea - June 16th 2005
3-layer FCCL, which has an epoxy adhesive layer (or an acrylic adhesive layer) between the copper and the polyimide, had been necessary for the manufacture of FPC and flexible substrates. Around 1999, 2-layer FCCL, which has neither epoxy nor acrylic between the copper and the polyimide, began to be used. The production value of 2-layer FCCL exceeded that of 3-layer FCCL in Japan in 2004. Outside Japan, 2-Layer FCCL is getting popular, too.

Among all the regional markets for 2-Layer FCCL, the Korean market seems to be the most promising. During the period between the second half of 2004 and the first half of 2005, Korean FCCL manufacturers has been gradually moving from the development/small production stage to the volume production stage.

Hanwha, Doosan, SD Flex, and LG Chemical are producing a small quantity of the cast-type FCCL. LG Cable, Hyun Sung St, and Atec Engineering are almost ready for volume production of the sputtering-type FCCL. Sang-A Flontec is producing a large quantity of the lamination-type FCCL. Hanwha and Doosan are also planning to participate in the lamination-type market. Supported by Japanese corporations, LG Cable's new lines will begin mass production in April 2005. DuPont and Cheil Industries, a Samsung company, have established a joint venture company named SD Flex, and SD Flex's lines will begin production in the third quarter of 2005.

Besides the Korean corporations, Taiwanese corporations such as Crest Technology, DuPont Wirex, Taiflex, ThinfFex are new participants in the 2-layer FCCL industry in Asia. Thus the competition among the Asian FCCL manufacturers must become keen in the near future.

Due to the growing demand for COF and multi-layer FPC used in cellular phones, the 2-layer FCCL market is expected to keep expanding. It is certain that, in the world, the production value of 2-layer FCCL will exceed that of 3-layer FCCL in the near future. Because of the structural change in the FCCL industry, the line-up of the industry leaders has changed. In the past, manufacturers of 3-layer FCCL such as DuPont, Arisawa, Nikkan were the leaders in the industry.

Nowadays, Nippon Steel Chemical, a manufacturer of 2-layer FCCL, is the leader in the industry.

Japan Marketing Survey Co., Ltd. has published a research report on the world FCCL industry by closely examining technological and marketing aspects of the industry.

Market Trends of IC Packages and Related Products
Emphasis on CSP/MCP/BGA Packages + IC Substrates + Package Materials + Substrate Materials

English version 30 June 2004 - 293 pages, 30cm x 21cm
132'000 JPY including shipping, Additional copy : 13'200 JPY
  • Main points of the Report
    • Market Sizes and Forecasts of IC Packages and IC Substrates by Various Types, 1999-2008 (Worldwide)
    • Production Trends of Major CSP Package Assemblers (Substrate Material Type, Ball Pitch, etc.)
    • Production Trends of IC Substrate Manufacturers (Package Type, Material Type, etc.)
    • Material Markets of IC Packages (Die Attach Film, ACF/NCF, ACP/NCP, Underfill, Solder Balls)
    • Material Markets of IC Substrates (CCL & Prepreg, Build-Up Materials, Solder Resist)

Table of Contents

1. Market Overview

  • IC Package Market Size and Forecast by Type, 1999-2008
  • Market Analyses of IC Packages, Demand Analyses
    • Market Trends by Package Type
  • Market Trends by Application
  • Largest IC Package Assemblers
    • Largest CSP/MCP/BGA Package Assemblers (2003)
    • Largest CSP Package Assemblers (2003)
    • Largest BGA Package Assemblers (2003)
    • Largest MCP Package Assemblers (2003)
  • La