Market Report for High Functional Copper Clad Laminates 2006
Analysis of high-frequency, heat resistant and Halogen-Free CCL Market

English 400'000 JPY, approximately 3400 USD Currency exchange
A4 Size, over 200 pages, English, Paper and CD included

Purpose the survey

The purpose of this survey is to analyze the global market of laminate materials. This time we focused especially on the analysis of heat resistant materials, high frequency materials and halogen-free materials.

Main point of the survey

>      Demand forecast through 2009 for each material in amount and volume

>      CCL Sales by material type and manufacturer / CCL Sales ranking top 30

>      Market breakdown of high functional materials by type (2004 -2009)

>      Market analysis for high frequency materials (resin type, application,  manufacturer, type & more)

>      Market analysis for heat resistant materials (Tg, application, manufacturer, type)

>      Analysis of market movement for halogen-free materials

>      Market analysis for glass cloth

>      Analysis for each application (cellular phone /PDA/ Notebook PC /DSC/DVC/PDP/LCDTV/ projection TV / DVD recorder / Video game / Car navigation system / base station / antenna /DBS/LNB/ probe card /etc.. millimeter wave radar system /LSI package)

Table of contents

Section 1, Summary

● Executive summary

A

1.Demand forecast for PWB by layer count for 2004 through 2009

2

2.Overall market size for CCL materials for PWB for 2004

4

3.Demand forecast for CCL by type for 2004-2009 in volume & amount (core material base)

6

4.Sales by product type and manufacturer for 2004

9

5.Sales ranking of top 30 companies for 2004

12

6.Market trend of high functional materials

1) Ratio of the high functional materials to total - Amount

14

2) Ratio of the high functional materials to total - Volume

15

7.Market breakdown of high functional materials by type for 2004 and 2009

1) In amount -2004

17

2) In volume -2004

17

3) In amount -2009

18

4) In volume -2009

18

5) By application

19

8.Market breakdown of high functional material by application for 2004

20

9.Sales of high functional material by manufacturer and type for 2004

21

10.Demand forecast for high functional materials for 2004 through 2009

23

1.Classification of high-frequency materials

26

2.Major high-frequency material and manufacturer, product trends by resin type

27

3.Market size for major high-frequency materials for 2004 in amount and volume

34

4.Market size by application for 2004

9

1) In amount

36

2) In volume

36

5.Applications of high-frequency/low loss PWB and CCL used and future trends

38

(Ref. only) Status of overseas

40

6.Manufacturers’ share for high-frequency material for 2004

43

7.Manufacturers’ share by application for 2004

34

1)Wireless application segment

45

2) High-speed digital application segment

46

3) LSI package substrate segment

47

8.Demand forecast for high-frequency materials by application for 2004-2009

1) In amount

48

2) In volume

49

9.Pricing trends for high-frequency materials

51

10.Users’ requirements for high-frequency materials

53

11.Comparative table for major high-frequency materials

54

12.Technical trend for high-frequency materials

55

1.Properties of major heat resistant resins

67

2.Definitions of heat resistance

68

3.Trend of technology development on heat resistant resins

69

4.Market size for heat resistant materials for 2004

71

5.Manufacturers’ share of heat resistant materials for 2004

1) Overall market share of high Tg materials for 2004

72

2) Market share of middle Tg + high Tg Materials for 2004

73

3) Manufacturers’ share of high Tg materials used for motherboard for 2004

75

4) Manufacturers’ share of high Tg materials used for package substrate for 2004

76

5) Market share by nationality of high Tg materials market for 2004

76

6.Demand forecast for heat resistant materials for 2004 through 2009

77

7.Pricing trends

79

1.Methodology for halogen-free

81

2.Supply chain for halogen-free materials in Japanese PWB market for cellular phones (Set-PWB-Material)

84

3.Sales status for 2004 by manufacturers

87

4.Sales amount and market share of halogen-free materials (by type, by manufacturer) for 2004

90

5.Manufacturers’ share for 2004

1) Phenolic paper

92

2) Composite material

92

3) Glass epoxy material, non-glass epoxy material

93

6.Demand forecast for halogen-free materials for 2004 through 2009

94

7.Pricing trends for halogen-free materials (Prices in Japan)

96

1.Introduction of glass cloth materials

98

2.Market participants

1) Japanese companies

102

2) Oversea companies

103

3.Manufacturing status of major Japanese glass cloth material manufacturers

104

4.Market size of glass cloth materials for 2004

105

5.Market breakdown for 2004

1) By type

105

2) Sales status by region

107

3) Manufacturers’ share of Japanese market for 2004

108

6.Demand forecast for 2004 through 2009

109

7.Technologies and strategies for each manufacturer

110

8.Pricing trends

111

9.Supply chain

112

1.Global electronics equipment market

115

2.Market status of cellular phone

1) Global cellular phone production trends

120

2) Global production forecast for cellular phones by region

121

3) Manufacturers’ share for 2004

122

4) Breakdown of cellular phones by system for 2004 through 2008

123

5) Global production forecast for color cellular phones by region for 2004 - 2008

124

6) Global production forecast for cellular phones with camera by region and trend for pixel count

125

7) Assembly technology roadmap for cellular phones

126

8) Requirements of PWB motherboard for cellular phones

127

9) Demand forecast for PWB for cellular phones by type for 2004 - 2008

128

3.PDA (mobile terminal)

1) Global PDA production trends

130

2) Manufacturers’ share for 2004

131

3) Assembly technology roadmap for PDA

132

4) Requirements for PWB motherboard for PDA

133

5) Demand forecast for PWB for PDA by type

134

4.Notebook PC

1) Global notebook PC production trends

136

2) Manufacturers’ share for 2004

137

3) Assembly technology roadmap for notebook PC

138

4) Requirements for PWB motherboard for notebook PC

139

5) Demand forecast for PWB for notebook PC

140

5.DSC (Digital Still Camera)

1) Global DSC production trends

142

2) Manufacturers’ share for 2004

143

3) Assembly technology roadmap for DSC

144

4) Requirements for PWB motherboard for DSC

145

5) Demand forecast for PWB for DSC type

146

6.DVC (Digital Video Camera)

1) Global production trends for DVC

148

2) Manufacturers’ share for 2004

149

3) Assembly technology roadmap for DVC

150

4) Requirements for PWB motherboard for DVC

151

5) Demand forecast for PWB for DVC by type

152

7.PDP TV

1) Global PDP TV production trends

154

2) Manufacturers’ share for 2004

155

3) Demand forecast for PWB for PDP TV

156

8.LCD TV

1) Global LDC TV production trends

158

2) Manufacturers’ share for 2004

159

3) Demand forecast for PWB for LCD TV by type

160

9.Rear projection TV

1) Global rear projection TV production trends

162

2) Manufacturers’ share for 2004

163

3) Demand forecast for PWB for rear projection TV by type

164

4) Packaging technology roadmap for TV

165

5) Requirements for PWB motherboard for TV

166

10.DVD recorder

1) Global DVD recorder production trends

167

2) Manufacturers’ share for 2004

168

3) Demand forecast for PWB for DVD recorder by type

169

11.Video game

1) Global video game production trends

171

2) Manufacturers’ share for 2004

172

3) Demand forecast for PWB for video game by type

173

12.Car navigation system

1) Global car navigation system production trends

175

2) Manufacturers’ share for 2004

176

3) Demand forecast for PWB for car navigation system by type

177

13.Market size estimation for high-density PWB

1) Global demand for build-up PWB by major application

179

2) Demand forecast for build-up PWB by layer count

181

14.Market trend for base station, antenna, amplifier and LNB

1) Japan

183

2) China

184

15.Market status for DBS (Satellite broadcast receiver) market in China

186

16.Market trend of probe card

1) Market trend

187

2) Overall market size for probe card through 2008

188

17.Outline of ETC and millimeter wave radar system

189

18.LSI package substrate market

1) Outline of resin-based rigid PWB for IC package

191

2) Production status for resin-based rigid PWB material for IC package by manufacturer

192

3) Market size estimation for resin-based PWB material for IC package

193

1.General purpose and middle Tg materials

196

2.Heat resistant materials

202

3.High-frequency materials

213